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合作模式  批量購(gou)買核心板(ban)的客戶(hu) 委(wei)托(tuo)定(ding)(ding)制(zhi)擴(kuo)展板(ban)的客戶(hu) 委(wei)托(tuo)定(ding)(ding)制(zhi)整(zheng)機的客戶(hu) 批量購(gou)買成熟方(fang)案(an)PCBA的客戶(hu)

模式特點  用戶(hu)選定核(he)心板(ban)后，根(gen)據(ju)我們提(ti)供的(de)設(she)計參(can)考資料，自(zi)行設(she)計生(sheng)產擴展板(ban)。

簡單、高效率、靈活性大、用戶可自行設計并生產 根據客戶產品功能需求和行業特點，基于現有核心板來設計擴展底板、開發驅動、功能驗證。
快速、低成(cheng)本地開發出客(ke)戶想要的(de)產品(pin) 根(gen)據客(ke)戶產品(pin)功(gong)能需求、殼具特點等(deng)，設計出直(zhi)(zhi)接(jie)量(liang)產的(de)產品(pin)。 根(gen)據現有成(cheng)熟產品(pin),為客(ke)戶直(zhi)(zhi)接(jie)生產產品(pin)。

提供資源  參考設計(ji)原(yuan)理(li)圖、核心(xin)板引腳(jiao)定(ding)(ding)(ding)(ding)義、PCB封裝(zhuang)、底板PCB、原(yuan)理(li)設計(ji)指(zhi)(zhi)導(dao)文檔、底板layout指(zhi)(zhi)導(dao)文檔、生產(chan)(chan)指(zhi)(zhi)導(dao)文檔、系(xi)統(tong)(tong)(tong)(tong)定(ding)(ding)(ding)(ding)制指(zhi)(zhi)導(dao)手(shou)冊、編(bian)譯(yi)(yi)/燒(shao)寫指(zhi)(zhi)導(dao)手(shou)冊、BSP源碼包(bao)、量(liang)產(chan)(chan)燒(shao)寫工具(ju)(ju)(ju)、測(ce)(ce)試(shi)工具(ju)(ju)(ju)等(deng) 系(xi)統(tong)(tong)(tong)(tong)定(ding)(ding)(ding)(ding)制指(zhi)(zhi)導(dao)手(shou)冊、編(bian)譯(yi)(yi)/燒(shao)寫指(zhi)(zhi)導(dao)手(shou)冊、BSP源碼包(bao)、量(liang)產(chan)(chan)燒(shao)寫工具(ju)(ju)(ju)、測(ce)(ce)試(shi)工具(ju)(ju)(ju)等(deng) 提供具(ju)(ju)(ju)有針(zhen)對性(xing)的(de)(de)系(xi)統(tong)(tong)(tong)(tong)平(ping)(ping)臺SDK、上(shang)層(ceng)(ceng)應(ying)用(yong)(yong)(yong)程(cheng)序(xu)開(kai)(kai)(kai)發(fa)(fa)環(huan)境(jing) 提供具(ju)(ju)(ju)有針(zhen)對性(xing)的(de)(de)系(xi)統(tong)(tong)(tong)(tong)平(ping)(ping)臺SDK、上(shang)層(ceng)(ceng)應(ying)用(yong)(yong)(yong)程(cheng)序(xu)開(kai)(kai)(kai)發(fa)(fa)環(huan)境(jing)、提供技術(shu)支持(chi)  原(yuan)理(li)圖審核、PCB審核、開(kai)(kai)(kai)發(fa)(fa)環(huan)境(jing)的(de)(de)搭(da)建、系(xi)統(tong)(tong)(tong)(tong)定(ding)(ding)(ding)(ding)制、驅動(dong)調(diao)試(shi)、SDK定(ding)(ding)(ding)(ding)制、應(ying)用(yong)(yong)(yong)調(diao)試(shi)方法、樣(yang)機調(diao)試(shi)、批量(liang)燒(shao)寫、系(xi)統(tong)(tong)(tong)(tong)升級(ji)、整機測(ce)(ce)試(shi)等(deng) 開(kai)(kai)(kai)發(fa)(fa)環(huan)境(jing)的(de)(de)搭(da)建、系(xi)統(tong)(tong)(tong)(tong)定(ding)(ding)(ding)(ding)制、驅動(dong)調(diao)試(shi)、SDK定(ding)(ding)(ding)(ding)制、應(ying)用(yong)(yong)(yong)調(diao)試(shi)方法、樣(yang)機調(diao)試(shi)、批量(liang)燒(shao)寫、系(xi)統(tong)(tong)(tong)(tong)升級(ji)、整機測(ce)(ce)試(shi)等(deng) 提供OS層(ceng)(ceng)、底層(ceng)(ceng)驅動(dong)的(de)(de)支持(chi)，配合(he)上(shang)層(ceng)(ceng)應(ying)用(yong)(yong)(yong)程(cheng)序(xu)開(kai)(kai)(kai)發(fa)(fa) 提供OS層(ceng)(ceng)、底層(ceng)(ceng)驅動(dong)的(de)(de)支持(chi)，配合(he)上(shang)層(ceng)(ceng)應(ying)用(yong)(yong)(yong)程(cheng)序(xu)開(kai)(kai)(kai)發(fa)(fa)

客戶類型  具(ju)(ju)備(bei)一(yi)定(ding)(ding)的(de)硬(ying)件設計能力；具(ju)(ju)備(bei)一(yi)定(ding)(ding)的(de)系統定(ding)(ding)制(zhi)、驅(qu)動開(kai)(kai)(kai)發的(de)能力，具(ju)(ju)有(you)上層(ceng)(ceng)應(ying)用程(cheng)序(xu)(xu)(xu)開(kai)(kai)(kai)發實(shi)(shi)力 具(ju)(ju)備(bei)一(yi)定(ding)(ding)的(de)系統定(ding)(ding)制(zhi)、驅(qu)動開(kai)(kai)(kai)發的(de)能力，具(ju)(ju)有(you)上層(ceng)(ceng)應(ying)用程(cheng)序(xu)(xu)(xu)開(kai)(kai)(kai)發實(shi)(shi)力 具(ju)(ju)備(bei)上層(ceng)(ceng)應(ying)用程(cheng)序(xu)(xu)(xu)開(kai)(kai)(kai)發實(shi)(shi)力 具(ju)(ju)備(bei)上層(ceng)(ceng)應(ying)用程(cheng)序(xu)(xu)(xu)開(kai)(kai)(kai)發實(shi)(shi)力

開發周期  視客戶開發進度 一般4～6周
根據實際情況而定 一般8～12周
根據實際情況(kuang)而定 隨時可(ke)直接購買

交付資源  核心板PCBA、量(liang)產工(gong)具 樣(yang)機、擴展(zhan)版原理圖、PCB、生產文件、量(liang)產工(gong)具 樣(yang)機、PCBA、二進(jin)制文件、SDK PCBA、二進(jin)制文件、SDK